印制電路:printed circuit
印制線路:printed wiring
印制板:printed board
印制板電路:printed circuit board (PCB)
印制線路板:printed wiring board(PWB)
印制元件:printed component
印制接點(diǎn):printed contact
印制板裝配:printed board assembly
板:board
單面印制板:single-sided printed board(SSB)
雙面印制板:double-sided printed board(DSB)
多層印制板:mulitlayer printed board(MLB)
多層印制電路板:mulitlayer printed circuit board
多層印制線路板:mulitlayer prited wiring board
剛性印制板:rigid printed board
剛性單面印制板:rigid single-sided printed borad
剛性雙面印制板:rigid double-sided printed borad
剛性多層印制板:rigid multilayer printed board
撓性多層印制板:flexible multilayer printed board
撓性印制板:flexible printed board
撓性單面印制板:flexible single-sided printed board
撓性雙面印制板:flexible double-sided printed board
撓性印制電路:flexible printed circuit (FPC)
撓性印制線路:flexible printed wiring
剛性印制板:flex-rigid printed board, rigid-flex printed board
剛性雙面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed
剛性多層印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board
齊平印制板:flush printed board
金屬芯印制板:metal core printed board
金屬基印制板:metal base printed board
多重布線印制板:mulit-wiring printed board
陶瓷印制板:ceramic substrate printed board
導(dǎo)電膠印制板:electroconductive paste printed board
模塑電路板:molded circuit board
模壓印制板:stamped printed wiring board
順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated mulitlayer
散線印制板:discrete wiring board
微線印制板:micro wire board
積層印制板:buile-up printed board
積層多層印制板:build-up mulitlayer printed board (BUM)
積層撓印制板:build-up flexible printed board
表面層合電路板:surface laminar circuit (SLC)
埋入凸塊連印制板:B2it printed board
多層膜基板:multi-layered film substrate(MFS)
層間全內(nèi)導(dǎo)通多層印制板:ALIVH multilayer printed board
載芯片板:chip on board (COB)
埋電阻板:buried resistance board
母板:mother board
子板:daughter board
背板:backplane
裸板:bare board
鍵盤板夾心板:copper-invar-copper board
動(dòng)態(tài)撓性板:dynamic flex board
靜態(tài)撓性板:static flex board
可斷拼板:break-away planel
電纜:cable
撓性扁平電纜:flexible flat cable (FFC)
薄膜開(kāi)關(guān):membrane switch
混合電路:hybrid circuit
厚膜:thick film
厚膜電路:thick film circuit
薄膜:thin film
薄膜混合電路:thin film hybrid circuit
互連:interconnection
導(dǎo)線:conductor trace line
齊平導(dǎo)線:flush conductor
傳輸線:transmission line
跨交:crossover
板邊插頭:edge-board contact
增強(qiáng)板:stiffener
基底:substrate
基板面:real estate
導(dǎo)線面:conductor side
元件面:component side
焊接面:solder side
印制:printing
網(wǎng)格:grid
圖形:pattern
導(dǎo)電圖形:conductive pattern
非導(dǎo)電圖形:non-conductive pattern
字符:legend
標(biāo)志:mark
二 基材:
基材:base material
層壓板:laminate
覆金屬箔基材:metal-clad bade material
覆銅箔層壓板:copper-clad laminate (CCL)
單面覆銅箔層壓板:single-sided copper-clad laminate
雙面覆銅箔層壓板:double-sided copper-clad laminate
復(fù)合層壓板:composite laminate
薄層壓板:thin laminate
金屬芯覆銅箔層壓板:metal core copper-clad laminate
金屬基覆銅層壓板:metal base copper-clad laminate
撓性覆銅箔絕緣薄膜:flexible copper-clad dielectric film
基體材料:basis material
預(yù)浸材料:prepreg
粘結(jié)片:bonding sheet
預(yù)浸粘結(jié)片:preimpregnated bonding sheer
環(huán)氧玻璃基板:epoxy glass substrate
加成法用層壓板:laminate for additive process
預(yù)制內(nèi)層覆箔板:mass lamination panel
內(nèi)層芯板:core material
催化板材:catalyzed board ,coated catalyzed laminate
涂膠催化層壓板:adhesive-coated catalyzed laminate
涂膠無(wú)催層壓板:adhesive-coated uncatalyzed laminate
粘結(jié)層:bonding layer
粘結(jié)膜:film adhesive
涂膠粘劑絕緣薄膜:adhesive coated dielectric film
無(wú)支撐膠粘劑膜:unsupported adhesive film
覆蓋層:cover layer (cover lay)
增強(qiáng)板材:stiffener material
銅箔面:copper-clad surface
去銅箔面:foil removal surface
層壓板面:unclad laminate surface
基膜面:base film surface
膠粘劑面:adhesive faec
原始光潔面:plate finish
粗面:matt finish
縱向:length wise direction
模向:cross wise direction
剪切板:cut to size panel
酚醛紙質(zhì)覆銅箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
環(huán)氧紙質(zhì)覆銅箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
環(huán)氧玻璃布基覆銅箔板:epoxide woven glass fabric copper-clad laminates
環(huán)氧玻璃布紙復(fù)合覆銅箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板:epoxide non woven/woven glass reinforced copper-clad laminates
聚酯玻璃布覆銅箔板:ployester woven glass fabric copper-clad laminates
聚酰亞胺玻璃布覆銅箔板:polyimide woven glass fabric copper-clad laminates
雙馬來(lái)酰亞胺三嗪環(huán)氧玻璃布覆銅箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
環(huán)氧合成纖維布覆銅箔板:epoxide synthetic fiber fabric copper-clad laminates
聚四乙烯玻璃纖維覆銅箔板:teflon/fiber glass copper-clad laminates
超薄型層壓板:ultra thin laminate
陶瓷基覆銅箔板:ceramics base copper-clad laminates
紫外線阻擋型覆銅箔板:UV blocking copper-clad laminates
三 基材的材料
A階樹(shù)脂:A-stage resin
B階樹(shù)脂:B-stage resin
C階樹(shù)脂:C-stage resin
環(huán)氧樹(shù)脂:epoxy resin
酚醛樹(shù)脂:phenolic resin
聚酯樹(shù)脂:polyester resin
聚酰亞胺樹(shù)脂:polyimide resin
雙馬來(lái)酰亞胺三嗪樹(shù)脂:bismaleimide-triazine resin
丙烯酸樹(shù)脂:acrylic resin
三聚氰胺甲醛樹(shù)脂:melamine formaldehyde resin
多官能環(huán)氧樹(shù)脂:polyfunctional epoxy resin
溴化環(huán)氧樹(shù)脂:brominated epoxy resin
環(huán)氧酚醛:epoxy novolac
氟樹(shù)脂:fluroresin
硅樹(shù)脂:silicone resin
硅烷:silane
聚合物:polymer
無(wú)定形聚合物:amorphous polymer
結(jié)晶現(xiàn)象:crystalline polamer
雙晶現(xiàn)象:dimorphism
共聚物:copolymer
合成樹(shù)脂:synthetic
熱固性樹(shù)脂:thermosetting resin
熱塑性樹(shù)脂:thermoplastic resin
感光性樹(shù)脂:photosensitive resin
環(huán)氧當(dāng)量:weight per epoxy equivalent (WPE)
環(huán)氧值:epoxy value
雙氰胺:dicyandiamide
粘結(jié)劑:binder
膠粘劑:adesive
固化劑:curing agent
阻燃劑:flame retardant
遮光劑:opaquer
增塑劑:plasticizers
不飽和聚酯:unsatuiated polyester
聚酯薄膜:polyester
聚酰亞胺薄膜:polyimide film (PI)
聚四氟乙烯:polytetrafluoetylene (PTFE)
聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP)
增強(qiáng)材料:reinforcing material
玻璃纖維:glass fiber
E玻璃纖維:E-glass fibre
D玻璃纖維:D-glass fibre
S玻璃纖維:S-glass fibre
玻璃布:glass fabric
非織布:non-woven fabric
玻璃纖維墊:glass mats
紗線:yarn
單絲:filament
絞股:strand
緯紗:weft yarn
經(jīng)紗:warp yarn
但尼爾:denier
經(jīng)向:warp-wise
緯向:weft-wise, filling-wise
織物經(jīng)緯密度:thread count
織物組織:weave structure
平紋組織:plain structure
壞布:grey fabric
稀松織物:woven scrim
弓緯:bow of weave
斷經(jīng):end missing
缺緯:mis-picks
緯斜:bias
折痕:crease
云織:waviness
魚(yú)眼:fish eye
毛圈長(zhǎng):feather length
厚薄段:mark
裂縫:split
捻度:twist of yarn
浸潤(rùn)劑含量:size content
浸潤(rùn)劑殘留量:size residue
處理劑含量:finish level
浸潤(rùn)劑:size
偶聯(lián)劑:couplint agent
處理織物:finished fabric
聚酰胺纖維:polyarmide fiber
聚酯纖維非織布:non-woven polyester fabric
浸漬絕緣縱紙:impregnating insulation paper
聚芳酰胺纖維紙:aromatic polyamide paper
斷裂長(zhǎng):breaking length
吸水高度:height of capillary rise
濕強(qiáng)度保留率:wet strength retention
白度:whitenness
陶瓷:ceramics
導(dǎo)電箔:conductive foil
銅箔:copper foil
電解銅箔:electrodeposited copper foil (ED copper foil)
壓延銅箔:rolled copper foil
退火銅箔:annealed copper foil
壓延退火銅箔:rolled annealed copper foil (RA copper foil)
薄銅箔:thin copper foil
涂膠銅箔:adhesive coated foil
涂膠脂銅箔:resin coated copper foil (RCC)
復(fù)合金屬箔:composite metallic material
載體箔:carrier foil
殷瓦:invar
箔(剖面)輪廓:foil profile
光面:shiny side
粗糙面:matte side
處理面:treated side
防銹處理:stain proofing
雙面處理銅箔:double treated foil
四 設(shè)計(jì)
原理圖:shematic diagram
邏輯圖:logic diagram
印制線路布設(shè):printed wire layout
布設(shè)總圖:master drawing
可制造性設(shè)計(jì):design-for-manufacturability
計(jì)算機(jī)輔助設(shè)計(jì):computer-aided design.(CAD)
計(jì)算機(jī)輔助制造:computer-aided manufacturing.(CAM)
計(jì)算機(jī)集成制造:computer integrat manufacturing.(CIM)
計(jì)算機(jī)輔助工程:computer-aided engineering.(CAE)
計(jì)算機(jī)輔助測(cè)試:computer-aided test.(CAT)
電子設(shè)計(jì)自動(dòng)化:electric design automation .(EDA)
工程設(shè)計(jì)自動(dòng)化:engineering design automaton .(EDA2)
組裝設(shè)計(jì)自動(dòng)化:assembly aided architectural design. (AAAD)
計(jì)算機(jī)輔助制圖:computer aided drawing
計(jì)算機(jī)控制顯示:computer controlled display .(CCD)
布局:placement
布線:routing
布圖設(shè)計(jì):layout
重布:rerouting
模擬:simulation
邏輯模擬:logic simulation
電路模擬:circit simulation
時(shí)序模擬:timing simulation
模塊化:modularization
布線完成率:layout effeciency
機(jī)器描述格式:machine descriptionm format .(MDF)
機(jī)器描述格式數(shù)據(jù)庫(kù):MDF databse
設(shè)計(jì)數(shù)據(jù)庫(kù):design database
設(shè)計(jì)原點(diǎn):design origin
優(yōu)化(設(shè)計(jì)):optimization (design)
供設(shè)計(jì)優(yōu)化坐標(biāo)軸:predominant axis
表格原點(diǎn):table origin
鏡像:mirroring
驅(qū)動(dòng)文件:drive file
中間文件:intermediate file
制造文件:manufacturing documentation
隊(duì)列支撐數(shù)據(jù)庫(kù):queue support database
元件安置:component positioning
圖形顯示:graphics dispaly
比例因子:scaling factor
掃描填充:scan filling
矩形填充:rectangle filling
填充域:region filling
實(shí)體設(shè)計(jì):physical design
邏輯設(shè)計(jì):logic design
邏輯電路:logic circuit
層次設(shè)計(jì):hierarchical design
自頂向下設(shè)計(jì):top-down design
自底向上設(shè)計(jì):bottom-up design
線網(wǎng):net
數(shù)字化:digitzing
設(shè)計(jì)規(guī)則檢查:design rule checking
走(布)線器:router (CAD)
網(wǎng)絡(luò)表:net list
計(jì)算機(jī)輔助電路分析:computer-aided circuit analysis
子線網(wǎng):subnet
目標(biāo)函數(shù):objective function
設(shè)計(jì)后處理:post design processing (PDP)
交互式制圖設(shè)計(jì):interactive drawing design
費(fèi)用矩陣:cost metrix
工程圖:engineering drawing
方塊框圖:block diagram
迷宮:moze
元件密度:component density
巡回售貨員問(wèn)題:traveling salesman problem
自由度:degrees freedom
入度:out going degree
出度:incoming degree
曼哈頓距離:manhatton distance
歐幾里德距離:euclidean distance
網(wǎng)絡(luò):network
陣列:array
段:segment
邏輯:logic
邏輯設(shè)計(jì)自動(dòng)化:logic design automation
分線:separated time
分層:separated layer
定順序:definite sequence
五 形狀與尺寸:
導(dǎo)線(通道):conduction (track)
導(dǎo)線(體)寬度:conductor width
導(dǎo)線距離:conductor spacing
導(dǎo)線層:conductor layer
導(dǎo)線寬度/間距:conductor line/space
第一導(dǎo)線層:conductor layer No.1
圓形盤:round pad
方形盤:square pad
菱形盤:diamond pad
長(zhǎng)方形焊盤:oblong pad
子彈形盤:bullet pad
淚滴盤:teardrop pad
雪人盤:snowman pad
V形盤:V-shaped pad
環(huán)形盤:annular pad
非圓形盤:non-circular pad
隔離盤:isolation pad
非功能連接盤:monfunctional pad
偏置連接盤:offset land
腹(背)裸盤:back-bard land
盤址:anchoring spaur
連接盤圖形:land pattern
連接盤網(wǎng)格陣列:land grid array
孔環(huán):annular ring
元件孔:component hole
安裝孔:mounting hole
支撐孔:supported hole
非支撐孔:unsupported hole
導(dǎo)通孔:via
鍍通孔:plated through hole (PTH)
余隙孔:access hole
盲孔:blind via (hole)
埋孔:buried via hole
埋/盲孔:buried /blind via
任意層內(nèi)部導(dǎo)通孔:any layer inner via hole (ALIVH)
全部鉆孔:all drilled hole
定位孔:toaling hole
無(wú)連接盤孔:landless hole
中間孔:interstitial hole
無(wú)連接盤導(dǎo)通孔:landless via hole
引導(dǎo)孔:pilot hole
端接全隙孔:terminal clearomee hole
準(zhǔn)表面間鍍覆孔:quasi-interfacing plated-through hole
準(zhǔn)尺寸孔:dimensioned hole
在連接盤中導(dǎo)通孔:via-in-pad
孔位:hole location
孔密度:hole density
孔圖:hole pattern
鉆孔圖:drill drawing
裝配圖:assembly drawing
印制板組裝圖:printed board assembly drawing
參考基準(zhǔn):datum referan